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Detection process

From the quality link control, from the three dimensions of pre-sale, sale and after-sales control of product quality, to ensure that each batch of goods delivered to customers do not have quality problems, so that customers have no worries.

Original supplier

100% quality guaranteed original goods

Authorized distributor

Quality assured sources from authorized dealers

Factory supply

Only accepted quality assurance factory supply

Open market

All materials are subject to quality testing

We have established cooperative relations with the world's first-tier IC manufacturers

Lishang Electronics always focuses on the expansion and development of the upstream and downstream of the electronic components industry, and constantly integrates the global high-quality IC spot resources, maintains close cooperation with world-class excellent electronic components agents for a long time, and actively expands the original channels at home and abroad, which can provide various electronic components products for domestic and foreign customers. Meet all your IC procurement needs, from research and development to mass production.

Quality control process
There are detailed inspection and testing procedures for different suppliers, different years, and different packaging conditions to ensure that the quality of goods from any channel is guaranteed before storage.
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Arrival notice
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QC Lab
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quality manager
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Detection Process
From the perspective of quality control, we control product quality from three dimensions: pre-sales, during sales, and after-sales, ensuring that every batch of products delivered to customers does not have quality issues, so that customers have no worries.

Appearance detection

Check the outer packaging to determine whether it is refurbished or original.

Electrical test

Use semiconductor test instruments to detect chip defects or damage through static, open, and short circuit parameter conditions.

Weldability test

Test whether the chip meets the standard by simulating the soldering amount of pins.

Ambient temperature test

Environmental temperature testing, simulation of various extreme environments have a lot of impact on products

De-cap test

Capping (unsealing) is mainly the use of instruments to corrode the package on the surface of the chip, check whether there is a wafer inside.

Ultrasonic scanning

Ultrasonic pulses are used to detect the presence of voids/delamination/cracks inside the sample.

Failure analysis

Through analysis to determine the failure mechanism, find out the failure causes, feedback to the design, manufacturing and use.

X-ray test

When X-Ray is used to penetrate different density materials, its light intensity changes differently, and the resulting contrast effect can form an image

Appearance detection

Check the outer packaging to determine whether it is refurbished or original.

Electrical test

Use semiconductor test instruments to detect chip defects or damage through static, open, and short circuit parameter conditions.

Weldability test

Test whether the chip meets the standard by simulating the soldering amount of pins.

Ambient temperature test

Environmental temperature testing, simulation of various extreme environments have a lot of impact on products

De-cap test

Capping (unsealing) is mainly the use of instruments to corrode the package on the surface of the chip, check whether there is a wafer inside.

Ultrasonic scanning

Ultrasonic pulses are used to detect the presence of voids/delamination/cracks inside the sample.

Failure analysis

Through analysis to determine the failure mechanism, find out the failure causes, feedback to the design, manufacturing and use.

X-ray test

When X-Ray is used to penetrate different density materials, its light intensity changes differently, and the resulting contrast effect can form an image