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XCZU17EG-3FFVD1760E

Part No :

XCZU17EG-3FFVD1760E

Manufacturer
Xilinx
Description
IC SOC CORTEX-A53 1760FCBGA
Catalog
Embedded - System On Chip (SoC)
DataSheet
XCZU17EG-3FFVD1760E PDF
Unit Price
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Stock Num
0
Min Qty
1
Series
Zynq® UltraScale+™ MPSoC EG
Package
Tray

XCZU17EG-3FFVD1760E Specifications

Type Description
rohs: RoHS
speed: 600MHz, 667MHz, 1.5GHz
ram size: 256KB
flash size: -
part status: Active
peripherals: DMA, WDT
architecture: MCU, FPGA
connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
core processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
package / case: 1760-BBGA, FCBGA
primary attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
operating temperature: 0°C ~ 100°C (TJ)
supplier device package: 1760-FCBGA (42.5x42.5)