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SM662PXE-BDST

Part No :

SM662PXE-BDST

Manufacturer
ISSI (Integrated Silicon Solution, Inc.)
Description
FERRI-EMMC 3D C 256GB TLC 153BGA
Catalog
Memory
DataSheet
SM662PXE-BDST PDF
Unit Price
Get QuoteQQ    Consult
Stock Num
0
Min Qty
1
Series
Ferri-eMMC®
Package
Tray

SM662PXE-BDST Specifications

Type Description
rohs: RoHS
technology: FLASH - NAND (TLC)
access time: -
memory size: 2Tb (256G x 8)
memory type: Non-Volatile
part status: Obsolete
memory format: FLASH
mounting type: Surface Mount
package / case: 100-LBGA
clock frequency: -
memory interface: eMMC
voltage - supply: -
operating temperature: -25°C ~ 85°C
supplier device package: 100-BGA (14x18)
write cycle time - word, page: -