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ATPL230AG55J19-Y

Part No :

ATPL230AG55J19-Y

Manufacturer
Microchip Technology
Description
PL230A-AKU-Y SAMG55J19A-MU LQFP
Catalog
Embedded - Microcontrollers - Application Specific
DataSheet
ATPL230AG55J19-Y PDF
Unit Price
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Stock Num
0
Min Qty
260
Package
Tray

ATPL230AG55J19-Y Specifications

Type Description
rohs: RoHS
ram size: -
interface: SPI
part status: Active
applications: Power Line Communications
mounting type: Surface Mount
number of i/o: -
core processor: External
package / case: -
voltage - supply: 3V ~ 3.6V
controller series: -
program memory type: -
operating temperature: -40°C ~ 85°C
supplier device package: -